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S.M Arnold
Proceedings of 43rd Annual AES Meeting
G. Sheng, C. Hu, W. Choi, K. Tu, Y. Bong, L. Nguyen (2002)
Tin whiskers studied by focused ion beam imaging and transmission electron microscopyJournal of Applied Physics, 92
Y. Zhang, J. Abys, C. Chen, T. Siegrist (1998)
An alternative surface finish for tin-lead soldersPlating and Surface Finishing, 85
S.M Arnold
Plating
K.M Cunningham, M.P Donahue
Tin whiskers: mechanisms of growth and prevention
Manfred Jordan (1997)
Lead-free Tin Alloys as Substitutes for Tin-lead Alloy PlatingTransactions of The Institute of Metal Finishing, 75
S. Britton (1974)
Spontaneous Growth of Whiskers on Tin Coatings: 20 Years of ObservationTransactions of The Institute of Metal Finishing, 52
R Schetty
Pb‐free component finishes
K. Tu (1973)
Interdiffusion and Reaction in Bimetallic Cu-Sn Thin FilmsActa Metallurgica, 21
S.C Britton
Transactions of the Institute of Metal Finishing
S.M Arnold
Metal whiskers – a factor in design
K.N Tu
Acta Metallurgica
D.E Endicott, K.T Kisner
A proposed mechanism for metallic whisker growth
T. Kakeshita, K. Shimizu, R. Kawanaka, Tomoharu Hasegawa (1982)
Grain size effect of electro-plated tin coatings on whisker growthJournal of Materials Science, 17
Y Zhang, C Xu, C Fan, J Abys
Electroplated tin and the whisker phenomenon
Many theories regarding whisker growth exist. It has been demonstrated in a variety of reference sources that tin whiskers can form in both pure tin and tin alloy deposits. Conversely, an equal number of claims exist in the literature demonstrating no whisker growth in the same types of deposits. The lack of an industry standard whisker test is a significant limitation in addressing tin whiskers. Historically in the electronics industry, addition of lead (Pb) was found to be an effective method of minimizing tin whisker formation and so for many years electronic components have been electroplated with tin‐lead (Sn‐Pb). With the advent of Pb‐free electronics finishing, the risk of tin whiskers is again a significant concern. This paper will review the theories behind whisker formation, identify the common characteristics of same, and demonstrate how Pb‐free electroplating processes can be formulated to minimize the risk of whisker formation.
Circuit World – Emerald Publishing
Published: Jun 1, 2001
Keywords: Whisker formation; Finishing; Electroplating
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