Thermal analysis for 3D optical network-on-chip based on a novel low-cost 6×6 optical router
Thermal analysis for 3D optical network-on-chip based on a novel low-cost 6×6 optical router
Ye, Yaoyao;Xu, Jiang;Wu, Xiaowen;Zhang, Wei;Liu, Weichen;Nikdast, Mahdi;Wang, Xuan;Wang, Zhehui;Wang, Zhe;
2012-05-01 00:00:00
http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png2012 Optical Interconnects ConferenceCrossRefhttp://www.deepdyve.com/lp/crossref/thermal-analysis-for-3d-optical-network-on-chip-based-on-a-novel-low-AVZkGZvLWI
Thermal analysis for 3D optical network-on-chip based on a novel low-cost 6×6 optical router
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