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Thermal analysis for 3D optical network-on-chip based on a novel low-cost 6×6 optical router

Thermal analysis for 3D optical network-on-chip based on a novel low-cost 6×6 optical router http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png 2012 Optical Interconnects Conference CrossRef

Thermal analysis for 3D optical network-on-chip based on a novel low-cost 6×6 optical router

2012 Optical Interconnects ConferenceMay 1, 2012
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Publisher
CrossRef
DOI
10.1109/oic.2012.6224422
Publisher site
See Article on Publisher Site

Abstract

Journal

2012 Optical Interconnects ConferenceCrossRef

Published: May 1, 2012

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