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Non‐hermetic Encapsulation and Assembly Techniques for Optoelectronic Applications

Non‐hermetic Encapsulation and Assembly Techniques for Optoelectronic Applications http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International CrossRef

Non‐hermetic Encapsulation and Assembly Techniques for Optoelectronic Applications

Microelectronics International , Volume 13 (1): 6-10 – Apr 1, 1996

Non‐hermetic Encapsulation and Assembly Techniques for Optoelectronic Applications

Microelectronics International , Volume 13 (1): 6-10 – Apr 1, 1996

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Publisher
CrossRef
ISSN
1356-5362
DOI
10.1108/13565369610800197
Publisher site
See Article on Publisher Site

Abstract

Journal

Microelectronics InternationalCrossRef

Published: Apr 1, 1996

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