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Improving the Heat Dissipation of Multilayer Ceramic Modules by the Use of CBGA Connections on HTCC and LTCC

Improving the Heat Dissipation of Multilayer Ceramic Modules by the Use of CBGA Connections on... http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International CrossRef

Improving the Heat Dissipation of Multilayer Ceramic Modules by the Use of CBGA Connections on HTCC and LTCC

Microelectronics International , Volume 13 (2): 54-56 – Aug 1, 1996

Improving the Heat Dissipation of Multilayer Ceramic Modules by the Use of CBGA Connections on HTCC and LTCC

Microelectronics International , Volume 13 (2): 54-56 – Aug 1, 1996

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Publisher
CrossRef
ISSN
1356-5362
DOI
10.1108/13565369610800269
Publisher site
See Article on Publisher Site

Abstract

Journal

Microelectronics InternationalCrossRef

Published: Aug 1, 1996

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