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Improving the Heat Dissipation of Multilayer Ceramic Modules by the Use of CBGA Connections on HTCC and LTCC

Improving the Heat Dissipation of Multilayer Ceramic Modules by the Use of CBGA Connections on... http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International CrossRef

Improving the Heat Dissipation of Multilayer Ceramic Modules by the Use of CBGA Connections on HTCC and LTCC

Lyszio, W.
Microelectronics International , Volume 13 (2): 54-56 – Aug 1, 1996
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Improving the Heat Dissipation of Multilayer Ceramic Modules by the Use of CBGA Connections on HTCC and LTCC

Lyszio, W.
Microelectronics International , Volume 13 (2): 54-56 – Aug 1, 1996

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Publisher
CrossRef
ISSN
1356-5362
DOI
10.1108/13565369610800269
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Abstract

Journal

Microelectronics International – CrossRef

Published: Aug 1, 1996

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