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Encapsulant for fatigue life enhancement of controlled-collapse chip connection (C4)

Encapsulant for fatigue life enhancement of controlled-collapse chip connection (C4) http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png IEEE Transactions on Components, Hybrids, and Manufacturing Technology CrossRef

Encapsulant for fatigue life enhancement of controlled-collapse chip connection (C4)

IEEE Transactions on Components, Hybrids, and Manufacturing Technology , Volume 16 (8): 863-867 – Jan 1, 1993

Encapsulant for fatigue life enhancement of controlled-collapse chip connection (C4)

IEEE Transactions on Components, Hybrids, and Manufacturing Technology , Volume 16 (8): 863-867 – Jan 1, 1993

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Publisher
CrossRef
ISSN
0148-6411
DOI
10.1109/33.273686
Publisher site
See Article on Publisher Site

Abstract

Journal

IEEE Transactions on Components, Hybrids, and Manufacturing TechnologyCrossRef

Published: Jan 1, 1993

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