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Characterisation of Polyimide‐glass‐metal Joints Bonded with Anisotropic Electrically Conductive Adhesives

Characterisation of Polyimide‐glass‐metal Joints Bonded with Anisotropic Electrically Conductive... http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics International CrossRef

Characterisation of Polyimide‐glass‐metal Joints Bonded with Anisotropic Electrically Conductive Adhesives

Microelectronics International , Volume 13 (2): 13-16 – Aug 1, 1996

Characterisation of Polyimide‐glass‐metal Joints Bonded with Anisotropic Electrically Conductive Adhesives

Microelectronics International , Volume 13 (2): 13-16 – Aug 1, 1996

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Publisher
CrossRef
ISSN
1356-5362
DOI
10.1108/13565369610800287
Publisher site
See Article on Publisher Site

Abstract

Journal

Microelectronics InternationalCrossRef

Published: Aug 1, 1996

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