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Scan-chain design and optimization for three-dimensional integrated circuits

Scan-chain design and optimization for three-dimensional integrated circuits Scan chains are widely used to improve the testability of integrated circuit (IC) designs and to facilitate fault diagnosis. For traditional 2D IC design, a number of design techniques have been proposed in the literature for scan-chain routing and scan-cell partitioning. However, these techniques are not effective for three-dimensional (3D) technologies, which have recently emerged as a promising means to continue technology scaling. In this article, we propose two techniques for designing scan chains in 3D ICs, with given constraints on the number of through-silicon-vias (TSVs). The first technique is based on a genetic algorithm (GA), and it addresses the ordering of cells in a single scan chain. The second optimization technique is based on integer linear programming (ILP); it addresses single-scan-chain ordering as well as the partitioning of scan flip-flops into multiple scan chains. We compare these two methods by conducting experiments on a set of ISCAS'89 benchmark circuits. The first conclusion obtained from the results is that 3D scan-chain optimization achieves significant wire-length reduction compared to 2D counterparts. The second conclusion is that the ILP-based technique provides lower bounds on the scan-chain interconnect length for 3D ICs, and it offers considerable reduction in wire-length compared to the GA-based heuristic method. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png ACM Journal on Emerging Technologies in Computing Systems (JETC) Association for Computing Machinery

Scan-chain design and optimization for three-dimensional integrated circuits

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References (48)

Publisher
Association for Computing Machinery
Copyright
Copyright © 2009 by ACM Inc.
ISSN
1550-4832
DOI
10.1145/1543438.1543442
Publisher site
See Article on Publisher Site

Abstract

Scan chains are widely used to improve the testability of integrated circuit (IC) designs and to facilitate fault diagnosis. For traditional 2D IC design, a number of design techniques have been proposed in the literature for scan-chain routing and scan-cell partitioning. However, these techniques are not effective for three-dimensional (3D) technologies, which have recently emerged as a promising means to continue technology scaling. In this article, we propose two techniques for designing scan chains in 3D ICs, with given constraints on the number of through-silicon-vias (TSVs). The first technique is based on a genetic algorithm (GA), and it addresses the ordering of cells in a single scan chain. The second optimization technique is based on integer linear programming (ILP); it addresses single-scan-chain ordering as well as the partitioning of scan flip-flops into multiple scan chains. We compare these two methods by conducting experiments on a set of ISCAS'89 benchmark circuits. The first conclusion obtained from the results is that 3D scan-chain optimization achieves significant wire-length reduction compared to 2D counterparts. The second conclusion is that the ILP-based technique provides lower bounds on the scan-chain interconnect length for 3D ICs, and it offers considerable reduction in wire-length compared to the GA-based heuristic method.

Journal

ACM Journal on Emerging Technologies in Computing Systems (JETC) – Association for Computing Machinery

Published: Jul 1, 2009

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