TY - JOUR
AB - WE publish in this issue, by courtesy of the Institute, two papers recently read before the Engineering Institute of Canada by members of the staff of the National Research Council on plastics and allied materials. Following as it does the description of the Duramold electronic process of gluing which appeared in these pages last month, Mr. W. Gallay's paper is of particular topical interest because it deals with another method of electrically heating the glue line developed in the Division of Chemistry at Ontario. Both systems have been evolved to overcome the difficulty of applying heat to cure the adhesive without the wood being involved, but Mr. Gallay's system seems to go a stage further by avoiding the use of special electric equipment and only calling on the normal supply. We are not familiar with  acetylene black  and do not know how far this is available in England. Its adoption ingeniously avoids the incorporation in the glue of substances likely to affect its qualities.
TI - WOOD AND PLASTICS
JF - Aircraft Engineering and Aerospace Technology
DO - 10.1108/eb031131
DA - 1944-06-01
UR - https://www.deepdyve.com/lp/emerald-publishing/wood-and-plastics-xjFpWf4lry
SP - 153
EP - 153
VL - 16
IS - 6
DP - DeepDyve
ER -