%0 Journal Article
%T Design, materials and process for lead‐free assembly of high‐density packages
%A Smetana, Joe
%A Horsley, Rob
%A Lau, John
%A Snowdon, Ken
%A Shangguan, Dongkai
%A Gleason, Jerry
%A Memis, Irv
%A Love, Dave
%A Dauksher, Walter
%A Sullivan, Bob
%J Soldering & Surface Mount Technology
%V 16
%N 1
%P 53-62
%@ 0954-0911
%D 2004-04-01
%I Emerald Group Publishing Limited
%~ DeepDyve