%0 Journal Article %T Design, materials and process for lead‐free assembly of high‐density packages %A Smetana, Joe %A Horsley, Rob %A Lau, John %A Snowdon, Ken %A Shangguan, Dongkai %A Gleason, Jerry %A Memis, Irv %A Love, Dave %A Dauksher, Walter %A Sullivan, Bob %J Soldering & Surface Mount Technology %V 16 %N 1 %P 53-62 %@ 0954-0911 %D 2004-04-01 %I Emerald Group Publishing Limited %~ DeepDyve