TY - JOUR
AU - Liu, J.
AB - This paper describes the influence of soldering parameters on solder joint quality and reliability of 0.65 mm pitch QFP technology. Soldering process parameters such as soldering temperature, conveyor speed and board size have systematically been varied using factorial experimental analysis. Solder joint quality has been characterised in terms of solder ball formation, open joints and porosity behaviour. Equipment used includes microfocus Xray nondestructive testing apparatus, optical and scanning electron microscope. The reliability of solder joints has been investigated by temperature cycling from 55 to  125C for 1000 cycles. The time per cycle was approximately 1 hour. The results from the present work show that pad layout on the printed circuit board PCB and the quality of pretinning during PCB production have a considerable influence on the solder joint yield. No failures have been observed during temperature cycling. This indicates that 0.65 mm 25 mil pitch QFP components have very high reliability in respect of temperature cycling and are extremely compliant for absorbing the thermal stress developed during temperature cycling.
TI - Process Yield and Reliability of 0.65 mm Pitch Technology in Surface Mounting
JF - Soldering & Surface Mount Technology
DO - 10.1108/eb037848
DA - 1994-01-01
UR - https://www.deepdyve.com/lp/emerald-publishing/process-yield-and-reliability-of-0-65-mm-pitch-technology-in-surface-z8o4U5iVva
SP - 5
EP - 10
VL - 6
IS - 1
DP - DeepDyve
ER -