TY - JOUR
AU - Fang, Weileun
AB - This study exploits the foundry available complimentary metal-oxide-semiconductor (CMOS) process and the packaging house available pick-and-place technology to implement a capacitive type micromachined 2-axis tilt sensor. The suspended micro mechanical structures such as the spring, stage and sensing electrodes are fabricated using the CMOS microelectromechanical systems (MEMS) processes. A bulk block is assembled onto the suspended stage by pick-and-place technology to increase the proof-mass of the tilt sensor. The low temperature UV-glue dispensing and curing processes are employed to bond the block onto the stage. Thus, the sensitivity of the CMOS MEMS capacitive type 2-axis tilt sensor is significantly improved. In application, this study successfully demonstrates the bonding of a bulk solder ball of 100 µm in diameter with a 2-axis tilt sensor fabricated using the standard TSMC 0.35 µm 2P4M CMOS process. Measurements show the sensitivities of the 2-axis tilt sensor are increased for 2.06-fold (x-axis) and 1.78-fold (y-axis) after adding the solder ball. Note that the sensitivity can be further improved by reducing the parasitic capacitance and the mismatch of sensing electrodes caused by the solder ball.
TI - Pick-and-place process for sensitivity improvement of the capacitive type CMOS MEMS 2-axis tilt sensor
JF - Journal of Micromechanics and Microengineering
DO - 10.1088/0960-1317/23/9/095029
DA - 2013-09-01
UR - https://www.deepdyve.com/lp/iop-publishing/pick-and-place-process-for-sensitivity-improvement-of-the-capacitive-yNY80QFf3s
SP - 095029
VL - 23
IS - 9
DP - DeepDyve
ER -