TY - JOUR
AU - Ge, Peng
AB - Lighting Res. Technol. 2017; Vol. 49: 932 Opinion: Chip scale packaged LEDs are far away from mass production Chip scale packaging for LEDs was regarded In the chip scale packaging process, the as a revolution in the packaging industry two following aspects should be most carefully considered. The first is the distance between years ago. Recently, I was involved in a neighbouring chips. This should be strictly project related to chip scale packaging in the controlled. At present there is a LED die- LED market. In the investigation I found that spread device that can solve the problem of the mass production of chip scale packaging the distances between chips. It can split LEDs is not available anywhere in the world, neighbouring chips by a same distance. The even in China which is the biggest LED second is that the position of the chip should packaging market. This is because while be precisely aligned to the substrate so that production is technically possible the cost of the cutting process becomes possible. The single chip is much higher than the common third is that the wavelength of the epitaxial surface mounted device/chip on board wafer should be precisely controlled. The 
TI - Opinion: Chip scale packaged LEDs are far away from mass production
JF - Lighting Research & Technology
DO - 10.1177/1477153517744722
DA - 2017-12-01
UR - https://www.deepdyve.com/lp/sage/opinion-chip-scale-packaged-leds-are-far-away-from-mass-production-uDPreeUObM
SP - 932
EP - 932
VL - 49
IS - 8
DP - DeepDyve
ER -