TY - JOUR
AU - Hartley, John
AB - Over the past year, the pattern in assembly of electronics components to printed circuit boards PCBs has changed dramatically, with far greater use of surface mounted devices SMDs in place of throughhole insertion of leaded devices. Therefore, most of the established makers of machinery have introduced special placement equipment. However, the Japanese were slow to introduce the vapour phase soldering needed for surface mounting, but now equipment, claimed to overcome the weaknesses of the early machines, is available.
TI - Surface mounting spurs automation
JF - Assembly Automation
DO - 10.1108/eb004213
DA - 1987-02-01
UR - https://www.deepdyve.com/lp/emerald-publishing/surface-mounting-spurs-automation-td5iA6P8JC
SP - 85
EP - 88
VL - 7
IS - 2
DP - DeepDyve
ER -