TY - JOUR
AU - Stojanović, Vladimir
AB - Front-end monolithic integration has enabled photonic devices to be fabricated in bulk and thin-SOICMOS as well as DRAM electronics processes. Utilizing the CMOS generic process model,integration was accomplished on multi-project wafers that were shared by standard electroniccustomers without requiring in-foundry process changes. Simple die or wafer-level post-processinghas enabled low-loss waveguides by the removal of the substrate within photonic regions. Thecustom-process model of the DRAM industry instead enabled optimization of the photonic devicefabrication process and the potential elimination of post-processing requirements. Integrated singlecrystallinesilicon waveguide loss of ~3 dB/cm has been achieved within a 45nm thin-SOI CMOSprocess that is currently used to manufacture microprocessors [1]. A fully monolithic photonictransmitter including a pseudo-random bit sequence (PRBS) generating digital backend was alsodemonstrated within this process [1]. The constraints of zero-change integration have limitedachieved polysilicon waveguide loss to ~50 dB/cm with commercially available bulk CMOSprocesses [2]. Custom polysilicon deposition and processing conditions available for DRAMintegration have also led to the demonstration of ~6 dB/cm loss waveguides suitable for integrationwithin electronics processes utilizing bulk silicon starting substrates [3]. An overview of requiredprocess features, device design guidelines and integration methodology tradeoffs will be presented.Relevant device metrics of area and energy efficiency as well as achievable photonic deviceperformance will be presented within the context of monolithic front-end integration within state-ofthe-art electronics processes. Applications of this research towards the implementation of acomputer system utilizing photonic interconnect for core-to-memory communication will also bediscussed.
TI - Integration of silicon photonics into electronic processes
JF - Proceedings of SPIE
DO - 10.1117/12.2004811
DA - 2013-02-02
UR - https://www.deepdyve.com/lp/spie/integration-of-silicon-photonics-into-electronic-processes-tJJjin32mv
SP - 86290F
EP - 86290F-12
VL - 8629
IS - 
DP - DeepDyve
ER -