TY - JOUR
AU - Ko, Sang Choon
AB - We propose a substrate with high thermal conductivity, manufactured by the low‐temperature co‐fired ceramic (LTCC) multilayer circuit process technology, as a new DC/DC converter platform for power electronics applications. We compare the reliability and power conversion efficiency of a converter using the LTCC substrate with the one using a conventional printed circuit board (PCB) substrate, to demonstrate the superior characteristics of the LTCC substrates. The power conversion efficiencies of the LTCC‐ and PCB‐based synchronous buck converters are 95.5% and 94.5%, respectively, while those of nonsynchronous buck converters are 92.5% and 91.3%, respectively, at an output power of 100 W. To verify the reliability of the LTCC‐based converter, two types of tests were conducted. Storage temperature tests were conducted at −20 °C and 85 °C for 100 h each. The variation in efficiency after the tests was less than 0.3%. A working temperature test was conducted for 60 min, and the temperature of the converter was saturated at 58.2 °C without a decrease in efficiency. These results demonstrate the applicability of LTCC as a substrate for power conversion systems.
TI - Efficiency improvement of a DC/DC converter using LTCC substrate
JF - ETRI Journal
DO - 10.4218/etrij.2018-0551
DA - 2019-12-01
UR - https://www.deepdyve.com/lp/wiley/efficiency-improvement-of-a-dc-dc-converter-using-ltcc-substrate-su2YjIR3ad
SP - 811
EP - 819
VL - 41
IS - 6
DP - DeepDyve
ER -