TY - JOUR
AU - 
AB - Journal of University of Shanghai for Science and Technology ISSN: 1007-6735 Yield Improvement in Wave Soldering Process by Using Customised Pallets 1 2 Dr.Salil Dey , Mr. Prince Kumar Additional General Manager, Bharat Electronics Limited,Panchkula (Haryana), India Deputy Manager, Bharat Electronics Limited, Panchkula(Haryana), India Abstract:Presently there are two types of components available in the Electronic Industries;they are 1. Surface-mounted Devices 2. Leaded components (through-hole components). Surface-mounted components can be assembled at first speed due to automation in the mounting and reflow soldering process. But the speed at which leaded components are mounted and soldered is not that fast. Hence there is always a challenge to match the production rate of PCB having leaded and surface mounted devices. Keywords:SMD, PCB, ESD 1. Introduction: The manufacturing of PCB assembly has undergone tremendous change. The change in process is necessitated due to an increase in demand for Electronics goods. To meet the demand, the component industry also changed the size and shape of components. Presently components are small in size and most of the components are changed to surface-mounted devices (SMD) for the ease of manufacturing. In the early 1970 most of the components used in the electronics industry were leaded components 
TI - Yield Improvement in Wave Soldering Process by Using Customised Pallets
JF - Journal of University of Shanghai for Science and Technology
DO - 10.51201/jusst/21/05343
DA - 2021-06-18
UR - https://www.deepdyve.com/lp/unpaywall/yield-improvement-in-wave-soldering-process-by-using-customised-sXOJOYU3nA
DP - DeepDyve
ER -