TY - JOUR
AU1 - Kurnosenko, A E
AU2 - Arabov, D I
AU3 - 
AB - This article considers the assembly technology of three-dimensional molded interconnect devices (3D MID). The problem of performance optimization for dispensing and component placement operations is explored. Optimization is assumed on the reduction of the auxiliary time of the dispensing/placement head and manipulator have to spend traveling through all component mounting positions. The problem is defined as the traveling salesman one. The article zeroed in distance/time matrix determination for dispensing/placement head and manipulator Corresponding Author: three-dimensional movements in the case of the selected kinematics diagram of the A. E. Kurnosenko assembly equipment. Formulas for the determination of this matrix are proposed, akurn@bmstu.ru formal description of the optimization problem is presented, and a brief review of Received: 22 July 2018 Accepted: 9 September 2018 problem-solving methods is described. Published: 8 October 2018 Publishingservicesprovidedby KnowledgeE 1.Introduction A. E. Kurnosenko and D. I. Arabov. This article is distributed The ongoing tendencies toward higher functional integration, miniaturization, and under the terms of the Creative manufacturability of electronic devices lead to the emergence and development of Commons Attribution License, which permits unrestricted use newclassesofmountingandinterconnectingstructuresdesignedtoreplacetraditional and redistribution provided that electronicmodulesonPCBsinsomeapplications.Oneoftheseclassesincludesmolded the original author and source interconnect mounting structures manufactured through 3D MID technologies. These are credited. 
TI - Optimization of Electronic Components Mounting Sequence for 3D MID Assembly Process
JF - KnE Engineering
DO - 10.18502/keg.v3i6.3009
DA - 2018-10-08
UR - https://www.deepdyve.com/lp/unpaywall/optimization-of-electronic-components-mounting-sequence-for-3d-mid-sVJeV6Rfe8
DP - DeepDyve
ER -