TY - JOUR
AU - Nakagawa, Yasuo
AB - An automatic visual inspection technique for solder joints on printed circuit boards has been developed. To detect the solder joint shape, structured light is used as the optical system and a simple waveform processing is applied to the extracted shape for judging the shape of a solder joint.
TI - Automatic Visual Inspection Of Solder Joints On Printed Circuit Boards
JF - Proceedings of SPIE
DO - 10.1117/12.933619
DA - 1982-11-22
UR - https://www.deepdyve.com/lp/spie/automatic-visual-inspection-of-solder-joints-on-printed-circuit-boards-rxux89u02a
SP - 121
EP - 127
VL - 336
IS - 
DP - DeepDyve
ER -