TY - JOUR
AU - Liu, Pei-Yi
AB - Most of the encapsulation films seen in the market use non‐pre‐metered coating technology, like dip coating or spray coating, which is difficult to control the film thickness, has poor film uniformity, low material utilization, and can only be coated on the front side, but cannot be used for three‐dimensional encapsulation.
TI - P‐77: Advanced Encapsulation Film for Micro‐LED Display
JF - Sid Symposium Digest of Technical Papers
DO - 10.1002/sdtp.15755
DA - 2022-06-01
UR - https://www.deepdyve.com/lp/wiley/p-77-advanced-encapsulation-film-for-micro-led-display-qnSH1QvZJ0
SP - 1328
EP - 1330
VL - 53
IS - 1
DP - DeepDyve
ER -