TY - JOUR
AU - 
AB - ISSN 2303-4521 Periodicals of Engineering and Natural Sciences Original Research Vol. 9, No. 4, September 2021, pp.443-441 1 * 1 Andrei Gorelov , Fedor Vasilyev Department of Digital Technologies and Information Systems, Moscow Aviation Institute (National Research University) ABSTRACT The use of additive technologies in the creation of soldering masks opens up new opportunities in the production of printed circuit boards, in particular, the use of soldering masks for boards with integrated components. The paper considers the results of experimental data on the adhesion of 3D soldering masks (that is, masks created on a 3D printer) obtained during the study of the introduction of 3D printing into electronic manufacturing processes. For the analysis of adhesion, it is possible to use such methods as breaking load, cross-cut test, and the sticky tape method. A number of experiments were conducted to study the adhesion by testing the breaking load. The samples were formed with different ratios of prepreg/solder mask, then the force at which the fracture occurred was measured. The essence of the cross-cut test is to apply at least three parallel cuts and perpendicular to them also at least three parallel cuts with the tip of the cutter. After the 
TI - 3D printed solder masks for printed circuit boards
JF - Periodicals of Engineering and Natural Sciences (PEN)
DO - 10.21533/pen.v9i4.2337
DA - 2021-09-17
UR - https://www.deepdyve.com/lp/unpaywall/3d-printed-solder-masks-for-printed-circuit-boards-q6dGLdx7Tr
DP - DeepDyve
ER -