TY - JOUR
AU - Peebles, H.C.
AB - A good solder flux must simultaneously perform a number of important functions. It must promote thermal transfer to the area of the solder joint, enhance wetting of the solder on the base metal, and prevent oxidation of the metal surfaces at soldering temperatures. However, its primary task is to remove the tarnish layer from the metal joint that is about to be soldered. Despite the fact that the process of soldering electronic devices is a part of a multibillion dollar industry, the actual chemical reactions that occur during this cleaning process are not well documented. In the case of organic acid or watersoluble fluxes, the flux reactions can be modelled by considering the interactions at the metalmetal oxideelectrolyte solution interface. Although such modelling systems have not frequently been applied to the behaviour of solder and fluxes, they are common for a number of other closely related chemical systems which are of practical interest, e.g., passivation layers on metals, electrochemical cells and metal oxide semiconductors. There are two types of reactions that can occur at the oxidesolution interface acidbase reactions and oxidationreduction reactions. The factors which affect the reaction rates and mechanisms are such variables as the structure of the metal oxide, temperature, pH, concentration of the electrolyte, and the chemical nature of the solute and solvent. By combining information about flux behaviour with available models of surface reactions, it should be possible to develop the theory of the flux reactions and to gain a better understanding of the factors which control the process.
TI - A Model of the Solder Flux Reaction Reactions at the Metal Metal OxideElectrolyte Solution Interface
JF - Circuit World
DO - 10.1108/eb044043
DA - 1995-04-01
UR - https://www.deepdyve.com/lp/emerald-publishing/a-model-of-the-solder-flux-reaction-reactions-at-the-metal-metal-nFMAP0Qu5L
SP - 10
EP - 13
VL - 21
IS - 4
DP - DeepDyve
ER -