TY - JOUR
AU - 
TI - Assembly level digital image correlation under reflow and thermal cycling conditions
JF - 2013 IEEE 63rd Electronic Components and Technology Conference
DO - 10.1109/ectc.2013.6575891
DA - 2013-05-01
UR - https://www.deepdyve.com/lp/crossref/assembly-level-digital-image-correlation-under-reflow-and-thermal-mryCt2BFBm
DP - DeepDyve
ER -