TY - JOUR
AU - Cordill, Megan J.
AB - IntroductionFlexible devices and sensors are a new field in the electronics sector and are used in a large variety of applications, such as foldable displays or as neural electrodes in medicine. The primary goal of designing flexible electronics is to achieve large (>10%) strains, without losing electronic functionality. Many designs to achieve this goal, consist of small islands of rigid electronics placed on a flexible polymer substrate and connected using metallic lines. In this design, the adhesion between lines and the underlying substrate is of great importance to device reliability. Failure of flexible electronic materials occurs in two forms, either the metallic conducting components fracture via through thickness crack formation or the metallic layers delaminate from the substrate. The cracking failure has been thoroughly addressed with several testing techniques, the most popular being tensile straining and bending. Both of these methods examine the cracking behavior as well as the electrical behavior. Techniques used to evaluate the adhesion of thin films to rigid substrates have advanced our understanding of adhesion and its mechanisms. While, these methods work well for films on rigid substrates in the case of flexible electronics, the matter becomes more challenging and the methods and models for 
TI - Thin Film Adhesion of Flexible Electronics Influenced by Interlayers 
JF - Advanced Engineering Materials
DO - 10.1002/adem.201600665
DA - 2017-04-01
UR - https://www.deepdyve.com/lp/wiley/thin-film-adhesion-of-flexible-electronics-influenced-by-interlayers-li4JTacGy0
SP - n/a
EP - n/a
VL - 19
IS - 4
DP - DeepDyve
ER -