TY - JOUR
AU - Zainal, Z.A.
AB - Purpose  This paper's purpose is to review the design of a flip chip thermal test vehicle.Designmethodologyapproach  Design requirements for different applications such as thermal characterization, assembly process optimization, and product burnin simulation are outlined and the design processes of different thermal test chip structures including the temperature sensor and passive heaters are described in detail. The design of fireball heater, a novel test chip structure used for evaluating the effectiveness of heat spreading of advanced thermal solutions, is also explained.Findings  Describes the design considerations and processes of the package substrate and printedcircuit board with special emphasis on the physical routing of the thermal test chip structures. These design processes are supported with thermal data from various finiteelement analyses carried out to evaluate the capability and limitations of thermal test vehicle design.Originalityvalue  The validation and calibration procedures of a thermal test vehicle are presented in this paper.
TI - Test chip and substrate design for flip chip microelectronic package thermal measurements
JO - Microelectronics International
DO - 10.1108/13565360610669959
DA - 2006-05-01
UR - https://www.deepdyve.com/lp/emerald-publishing/test-chip-and-substrate-design-for-flip-chip-microelectronic-package-jsmPr71THK
SP - 3
EP - 10
VL - 23
IS - 2
DP - DeepDyve
ER -