TY - JOUR
AU - Winterbottom, W. L.
AB - Materials Issues in the Multichip Module Packaging of Electronics _____ D.B. Knorr, D.R. Frear, and W.L. Winterbottom Multichip modules (MCMs) are an interconnect wiring; dielectric polymer failure modes. R Darveaux, K.L. Murty, electronic packaging concept where films; and ceramic, composite, or silicon and 1. Turlik discuss work on the ther­ many unpackaged chips are mounted in substrates. The papers in this issue dis­ momechanical behavior of solder joints close proximity on a single substrate. cuss the relationships found in this array for MCM applications in their paper on The electrical design of MCMs is well in of materials and the application of these predictive thermal and mechanical hand, but the need for the development factors to the important functions of an modeling. They conclude that, as power of advanced materials for this packag­ electronic package. The MCM-D and, to increases, the accelerated tests used to ing concept is critical. Moreover, MCM a lesser extent, MCM-C technologies are examine reliability more closely ap­ packaging is one of the fastest growing considered. The papers were assembled proximate field-use conditions. areas in the electronics industry. This in a collaborative effort between two At the 1992 TMS Annual Meeting in issue of JOM 
TI - Materials issues in the multichip module packaging of electronics
JF - JOM
DO - 10.1007/BF03222267
DA - 1992-07-01
UR - https://www.deepdyve.com/lp/springer-journals/materials-issues-in-the-multichip-module-packaging-of-electronics-jHq34bzbo4
SP - 7
EP - 7
VL - 44
IS - 7
DP - DeepDyve
ER -