TY - JOUR
AU - Raj, Kannan
AB - We present a hybrid integration technology platform for the compact integration of best-in-breed VLSI and photonic circuits. This hybridization solution requires fabrication of ultralow parasitic chip-to-chip interconnects on the candidate chips and assembly of these by a highly accurate flip-chip bonding process. The former is achieved by microsolder bump interconnects that can be fabricated by wafer-scale processes, and are shown to have average resistance <1 ohm/bump and capacitance <25fF/bump. This suite of technologies was successfully used to hybrid integrate high speed VLSI chips built on the 90nm bulk CMOS technology node with silicon photonic modulators and detectors built on a 130nm CMOS-photonic platform and an SOI-photonic platform; these particular hybrids yielded Tx and Rx components with energies as low as 320fJ/bit and 690fJ/bit, respectively. We also report on challenges and ongoing efforts to fabricate microsolder bump interconnects on next-generation 40nm VLSI CMOS chips.
TI - Hybrid-integrated silicon photonic bridge chips for ultralow-energy inter-chip communications
JF - Proceedings of SPIE
DO - 10.1117/12.876526
DA - 2011-01-31
UR - https://www.deepdyve.com/lp/spie/hybrid-integrated-silicon-photonic-bridge-chips-for-ultralow-energy-ikq0vzTh8V
SP - 79440B
EP - 79440B-11
VL - 7944
IS - 1
DP - DeepDyve
ER -