TY - JOUR
AU - Crowley, Daniel F.
AB - Abstract not available
TI - High-precision die bonding for photonics packaging
JF - Proceedings of SPIE
DO - 10.1117/12.475483
DA - 2003-06-02
UR - https://www.deepdyve.com/lp/spie/high-precision-die-bonding-for-photonics-packaging-hk4v9pFqGd
SP - 49
EP - 55
VL - 4997
IS - 1
DP - DeepDyve
ER -