TY - JOUR
AU - Lantaires, J.
AB - The increase in semiconductor integration level has led to complex Integrated Circuits ICs characterised by an increasing number of IO, such that dies with 40 to 84 metallised pads are currently manufactured and frequently used in modern electronic systems. The advent from 1980 onwards of these LSIVLSI semiconductors requires new economical micropackages to be devised that can be adapted to surface mounting techniques on Hybrid Integrated Circuits HICs and Printed Circuits Boards PCBs. Plastic encapsulation using a transfer moulded epoxy resin is a widely used method for packaging silicon devices because of the reduced manufacturing cost for large volumes. This economic criterion, which is considered with widespread interest in the electronics industry, has recently led the major semiconductor manufacturers to produce Plastic Leaded Chip Carriers PLCCs with up to 84 J bend connections on 127 mm pitch, and Mini Quad Packs with 40 to 84 Z bend pins on 075080mm centres. However, until now, a significant number of ICs, such as full custom circuits, are not yet available in any packaged form. Thus, in order to take advantage of the compactness offered by micropackages without being under component manufacturers' constraints for packaged LSI needs, it was decided at the Microelectronics Division of CITAlcatel to develop a flexible semiconductor encapsulation technology which does not require any moulding equipment. The process involved has led to the development of a small economical package with 52 peripheral Z bend leads on 075 mm centres which has been evaluated. This original LSI carrier, named Plastic Composite Package PCP because of its special feature, is perfectly suited to the specific needs of multilayer HICs for all nonmilitary applications. In addition, another PCP format with 68 pins on 0635 mm centres, designed for LSI Industrial applications, has been investigated. The purpose of this paper is to explain the specific needs in the hybrid industry and to give the authors' views on trends in LSIVLSI plastic encapsulation. Moreover, the PCP manufacturing process is described, the evaluation results being discussed as well as the economic aspect.
TI - The Plastic Composite Package Provides an Economic Alternative To LSIVLSI Packaging for High Density Microcircuits
JF - Microelectronics International
DO - 10.1108/eb044191
DA - 1985-04-01
UR - https://www.deepdyve.com/lp/emerald-publishing/the-plastic-composite-package-provides-an-economic-alternative-to-hhFHh4pNYB
SP - 5
EP - 12
VL - 2
IS - 4
DP - DeepDyve
ER -