TY - JOUR
AU - Roberts, William R.
AB - The need to improve the Overlay and CD Budget requirements of current device technologies has driven the introduction of tool dedication schemes in semiconductor manufacturing. Dedication schemes have provided an opportunity to minimize systematic field distortion differences from layer to layer. The cost and manufacturing complexity of dedication schemes can however be a burden on the process and tools required. We will present experimental results of an aberration measurement method used on a Front End of Line tool-set to empirically describe the matching of a series of tools used in a dedicated processing scheme. We will also show simulation results of Pattern Placement Error and CD uniformity effects for the highlighted aberrations. We will use these findings to support product results generated while exercising dedication break analyses experiments on this tool set.
TI - Aberration measurement and matching: a correlation of measurement techniques and dedication scheme implications
JF - Proceedings of SPIE
DO - 10.1117/12.535288
DA - 2004-05-28
UR - https://www.deepdyve.com/lp/spie/aberration-measurement-and-matching-a-correlation-of-measurement-hNZrSIZ2sY
SP - 1921
EP - 1928
VL - 5377
IS - 1
DP - DeepDyve
ER -