TY - JOUR
AU - Oberhoffer, R
AB - New polystyrene (PS) foams with submicron pore sizes and open pore structure are introduced as potential cores for vacuum insulation panels (VIPs). Measurements of the thermal conductivity λ of the air-filled and evacuated PS foams, the influence of temperature T, opacifiers as well as gas pressure p on the thermal conductivity λ are presented. First results of the foam microstructures, as visualized by electron microscopy, confirm that pore sizes below 1 µm can be achieved. Thermal conductivity values of advanced samples in vacuum of about 7 mW/(m·K) were measured.
TI - Thermal conductivity analysis of a new sub-micron sized polystyrene foam
JF - Journal of Cellular Plastics
DO - 10.1177/0021955X20943101
DA - 2020-01-01
UR - https://www.deepdyve.com/lp/sage/thermal-conductivity-analysis-of-a-new-sub-micron-sized-polystyrene-f4w0DXrDWf
SP - 0021955X2094310
VL - OnlineFirst
IS - 
DP - DeepDyve
ER -