TY - JOUR
AB - 第 58 卷第 2 期 Vol.58 No.2 机 械 工 程 学 报 2022 年 1 月 Jan. 2022 JOURNAL OF MECHANICAL ENGINEERING DOI：10.3901/JME.2022.02.307 - - Cu/Sn-58Bi/Cu 电 热 力耦合载荷下非均匀组织 微焊点拉伸力学性能研究 1, 2 1 1 1 1, 2 李望云 李兴民 汪 健 梁泾洋 秦红波 (1. 桂林电子科技大学机电工程学院 桂林 541004； 2. 桂林电子科技大学广西制造系统与先进制造技术重点实验室 桂林 541004) 摘要：电子封装微焊点往往在电、热、力等多种载荷共同作用下服役，且具有鲜明的组织不均匀特征。研究电-热-力耦合载 荷下电流密度和温度对电子封装组织不均匀线型 Cu/Sn-58Bi/Cu 微焊点拉伸力学性能及其尺寸效应的影响。结果表明，较低 Cu 温度和较低电流密度情况下，随焊点高度降低， 基底对钎料的力学约束增强，焊点拉伸强度提高，断裂发生在钎料体内， 呈韧性断裂，与室温无电流情况下的力学行为和断裂模式一致。钎料内 Sn 相与 Bi 相电流密度非均匀分布所致的局部电流拥 挤现象使两相间的温度梯度明显增加，因此由热膨胀系数差异所致的相界面应变失配和界面应力增大，致使焊点强度低于室 温无电流加载时的值。随着温度和电流密度升高，Sn 相与 Bi 相界面及钎料与 IMC 层界面的应变失配和界面应力加剧，导致 /IMC - 焊点拉伸强度进一步下降；同时，断裂位置从钎料基体内逐渐转移至钎料 层界面处，断裂模式由韧性断裂转为韧 脆混 合断裂。 关键词：组织不均匀微焊点；电-热-力耦合载荷；拉伸力学性能 中图分类号：TG115 Tensile Performance of Inhomogeneous Microscale Cu/Sn-58Bi/Cu Solder Joints under Electro-thermo-mechanical Coupled Loads 1, 2 1 1 1 1, 2 LI Wangyun LI Xingmin WANG Jian LIANG Jingyang QIN Hongbo (1. School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004; 2. Guangxi Key Laboratory of Manufacturing System and Advanced Manufacturing Technology, Guilin University of Electronic Technology, Guilin 541004) Abstract：The microscale solder joint in electronic packaging usually serves under the coupled loading of electric current, heat and mechanical stress, which has a distinct inhomogeneous microstructure. Tensile performance of inhomogeneous microscale line-type Cu/Sn-58Bi/Cu solder joints with different current densities and temperatures as well as their size effects are investigated under electro-thermo-mechanical coupled loads. The results show that at low 
TI - Tensile Performance of Inhomogeneous Microscale Cu/Sn-58Bi/Cu Solder Joints under Electro-thermo-mechanical Coupled Loads
JF - Journal of Mechanical Engineering
DO - 10.3901/jme.2022.02.307
DA - 2022-01-01
UR - https://www.deepdyve.com/lp/unpaywall/tensile-performance-of-inhomogeneous-microscale-cu-sn-58bi-cu-solder-djOuEdhiLQ
DP - DeepDyve
ER -