TY - JOUR
AU1 - Jen Su, Te
AU2 - National Kaohsiung University of Applied Sciences, Taiwan
AU3 - Chen, Yi-Feng
AU4 - Cheng, Jui-Chuan
AU5 - Wang, Shih-Mine
AU6 - Tsou, Tung-Yen
AU7 - 
AB - International Journal of Modeling and Optimization, Vol. 5, No. 5, October 2015 Te-Jen Su, Chien-Liang Chiu, Yi-Feng Chen, Shih-Mine Wang, Tung-Yen Tsou Abstract—FOW (Film On Wire) is one method of stack die II. ROOT CAUSE ANALYSIS for IC assembly process. This film material would cover the A. Cause and Effect Analysis gold wire which electrical conduction, to prevent the gold wire damage cause the product fail in the stack die chip on die bond To investigate and analyze the film burr issue, the cause process, but this film is easy to occur film burr issue during and effect (fishbone) diagram was applied. This method of wafer dicing saw process. If film burr occur, it will cause die analysis was based on major factors such as man, machine, bond pad contamination, such that will cause gold wire can’t material, and method to brainstorm all possible causes of eutectic with bond pad, and IC product will be fail then cause the problem according to everyone’s past experiences to yield loss. detail various possible small factor cause analyses. The In this paper, experiment how to apply the blade dressing fishbone diagram of the FOW film burr issue is shown in method improvement 
TI - Improvement of Wafer Saw Film Burr Issues
JF - International Journal of Modeling and Optimization
DO - 10.7763/ijmo.2015.v5.486
DA - 2015-01-01
UR - https://www.deepdyve.com/lp/unpaywall/improvement-of-wafer-saw-film-burr-issues-dZb9BD0Me3
DP - DeepDyve
ER -