TY - JOUR
AU - Glavina, P. G.
AB - The application of electroless plating as a simple low‐temperature deposition process for selective patterning of Ni films on silicon wafer to produce Ni micromechanical structures is presented. Ni structures are formed by catalytic reduction of Ni++ ions in solution. The patterned films are resistant to anisotropic silicon etchants, making the structures suitable for subsequent maskless silicon micromachining to produce Ni micromechanical structures. Ni Purity as high as 99.5% is routinely achieved using this process. Simplicity of electroless plating and the relatively few masking steps make this technique attractive for the production of Ni micromechanical structures for sensors and actuators (transducers) fabrication.
TI - Fabrication of Nickel Micromechanical Structures Using a Simple Low‐Temperature Electroless Plating Process
JF - Journal of the Electrochemical Society
DO - 10.1149/1.2220780
DA - 1993-07-01
UR - https://www.deepdyve.com/lp/iop-publishing/fabrication-of-nickel-micromechanical-structures-using-a-simple-low-dIMXehSSln
SP - L111
EP - L113
VL - 140
IS - 7
DP - DeepDyve
ER -