TY - JOUR
AU1 - Yun, Wang
AB - As the rapid market need of micro-electro-mechanical systems engineering gives it the wide development and application ranging from mobile phones to medical apparatus, the need of metal micro-parts is increasing gradually. Microforming technology challenges the plastic processing technology. The findings have shown that if the grain size of the specimen remains constant, the flow stress changes with the increasing miniaturization, and also the necking elongation and the uniform elongation etc. It is impossible to get the specimen material properties in conventional tensile test machine, especially in the high precision demand. Therefore, one new measurement method for getting the specimen material-mechanical property with high precision is initiated. With this method, coupled with the high speed of Charge Coupled Device (CCD) camera and high precision of Coordinate Measuring Machine (CMM), the elongation and tensile strain in the gauge length are obtained. The elongation, yield stress and other mechanical properties can be calculated from the relationship between the images and CCD camera movement. This measuring method can be extended into other experiments, such as the alignment of the tool and specimen, micro-drawing process.
TI - Measurement of material mechanical properties in microforming
JF - Proceedings of SPIE
DO - 10.1117/12.674352
DA - 2006-02-13
UR - https://www.deepdyve.com/lp/spie/measurement-of-material-mechanical-properties-in-microforming-dGoiUv6syl
SP - 61493G
EP - 61493G-5
VL - 6149
IS - 1
DP - DeepDyve
ER -