TY - JOUR
AB - Sensors and Materials, Vol. 30, No. 5 (2018) 1081–1090 1081 MYU Tokyo S & M 1565 Miniaturization of MEMS Capacitive Accelerometers Fabricated Using Silicon-on-insulator-MEMS Technology Jiannan Liu and Hideo Muro Chiba Institute of Technology, 2-17-1 Tsudanuma, Narashino, Chiba 275-0016, Japan (Received July 31, 2017; accepted November 16, 2017) Keywords: miniaturization, capacitive, beam configuration, sensitivity, resonant frequency In our previous work, we studied capacitive micro-accelerometers fabricated using a simple silicon-on-insulator (SOI)-MEMS technology and the feasibility of an accelerometer with a beam length as long as the side length of the proof mass. In this work, we investigate the dependences of their sensitivities and resonant frequencies on the beam parameters and its configuration and study the method of designing the stuctures of capactive accelerometers with beam lengths as long as the side length of the proof mass in order to miniaturize the device. 1. Introduction Since MEMS sensors were initially commercialized as accelerometers for airbag systems in the 1990s, they have been widely used for various applications such as movement detection in (1) hand-held mobile terminals and control devices, and the technologies have made significant progress in performance, compactness, and reliability. The common detection mechanisms for (2) (3,4) (5) accelerometers are 
TI - Miniaturization of MEMS Capacitive Accelerometers Fabricated Using Silicon-on-insulator-MEMS Technology
JF - Sensors and Materials
DO - 10.18494/sam.2018.1716
DA - 2018-01-01
UR - https://www.deepdyve.com/lp/unpaywall/miniaturization-of-mems-capacitive-accelerometers-fabricated-using-d0tb8CEYX4
DP - DeepDyve
ER -