TY - JOUR
AU - Kang, S.
AB - Solder joints were prepared from seven eutectic and near-eutectic Sn-based compositions and characterized for electrical resistivity after 100 h and 1,000 h of isothermal aging at 423 K. The solder joint samples were prepared by hand soldering to copper substrates, and the post-heat treatment resistivity was measured at room temperature in a specially designed, four-point probe fixture. Compositions tested included Sn-3.5Ag, Sn-3.7Ag-0.9Cu, Sn-3.0Ag-0.5Cu, Sn-3.6Ag-1.0Cu, and Sn-3.9Ag-0.6Cu. In addition, the effect of a minor addition of a fourth element, designed to improve high-temperature shear strength, was also evaluated in the compositions Sn-3.7Ag-0.6Cu-0.3Co and Sn-3.7Ag-0.7Cu-0.2Fe. The observed changes in electrical resistivity are discussed in terms of microstructural coarsening, diffusional transport from the substrate, and nucleation of precipitate phases.
TI - Isothermal aging of near-eutectic Sn-Ag-Cu solder alloys and its effect on electrical resistivity
JF - Journal of Electronic Materials
DO - 10.1007/s11664-003-0105-3
DA - 2003-03-28
UR - https://www.deepdyve.com/lp/springer-journals/isothermal-aging-of-near-eutectic-sn-ag-cu-solder-alloys-and-its-bYZt5Rbm4c
SP - 1384
EP - 1391
VL - 32
IS - 12
DP - DeepDyve
ER -