TY - JOUR
AU - Beckert, Erik
AB - Technical challenges and directions for microoptical and optoelectronical packaging include the development of special handling tools for manual and automated assembly stations. These tools not only have to be precise, but also reliable in a mass production environment. The design process for handling devices therefore is a major issue and an approach to it will be presented. Several examples illustrate how the proposed design algorithm was used to solve assembly tasks like fiber handling and microlens- positioning.
TI - Handling of micro-optical components for microassembly
JF - Proceedings of SPIE
DO - 10.1117/12.462853
DA - 2002-04-19
UR - https://www.deepdyve.com/lp/spie/handling-of-micro-optical-components-for-microassembly-acbEL040qm
SP - 531
EP - 543
VL - 4755
IS - 1
DP - DeepDyve
ER -