TY - JOUR AU - Wang, Theodore AB - Introduction Implantable devices for restoring, replacing or controlling lost or dysfunctional neural circuits are a valuable therapeutic option for a variety of diseases of the central, peripheral, and autonomic nervous systems. Fueled by the miniaturization of electronic and power supply components, as well as by the advances in systems neuroscience [1] a new generation of implantable devices has emerged for mapping cortical circuits [2–4] and implementing neuromodulation-based therapies for Parkinson’s disease [5], epilepsy [6–8], depression [9,10], and mood disorders [11–13]. Research in brain-computer interfaces (BCI) has also led to impressive demonstrations of the potential of cortical neuroprostheses to restore motor and sensory functions in paralyzed patients [14–18]. Implantable electrodes establish intimate contact between man-made devices and neural circuits, and are a core component of all these technologies. Yet, the long-term stability and reliability of electrode implants, especially in the brain, still hampers the clinical translation of many diagnostic and therapeutic neurotechnologies. Clinical and research intracranial electrodes can be classified into those that penetrate the brain parenchyma and are implanted in cortex or a specific brain structure (a.k.a. “depth” electrodes), and subdural electrodes (a.k.a. ECoG electrodes), typically strips or grids of metal contacts arranged on a polymer substrate that sit on the cortical surface without penetrating it. A large number of studies have investigated the issue of reliability and biocompatibility of penetrating electrodes, especially in the context of intracortical microelectrodes for BMIs. Histological analysis of the foreign body reaction to intracortical microelectrodes implanted in animal models, evidenced the issues of severe inflammation, neurodegeneration and scarring around the electrode implant. However, studies in human patients focusing on the inflammatory response to subdural electrodes evidenced severe histopathological alterations as early as 1 day after implantation in more than 50% of patients [19]. Furthermore, comparative evaluation in patients simultaneously implanted with depth and subdural electrodes demonstrated that subdural implants elicited a significantly more severe inflammatory reaction than penetrating devices. Finally, longitudinal impedance monitoring in patients chronically implanted with responsive neurostimulators demonstrated that the impedance of the subdural electrodes increased by more than 53% over the course of the first 100 days [20,21], whereas the impedance of depth electrodes in the same subjects only increased by 22% [20,21]. These impedance variations are likely due to the formation of fibrous scar tissue around the implant. As ECoG recordings from chronic subdural electrodes are processed by algorithms in closed-loop neurostimulators, such marked variation in the impedance can strongly impact signal power and quality, thus significantly affecting detection algorithm performance, clinical decision-making [22] and, ultimately, patient outcome. Despite this growing body of evidence of the extensive tissue reaction severely affecting the reliability of subdural electrodes, however, no available study has investigated potential strategies to promote the long-term integration of subdural electrode and mitigate the scar tissue formation. Studies on intracortical BCI electrodes suggest that, in addition to minimizing implant footprint [23–25] and mechanical stiffness [26–28], the integration of biological material at the electrode-tissue interface can play a major role in determining the extent of the foreign body reaction and fibro-gliotic encapsulation around synthetic implants. Examples of this biomimetic approach [29] include controlled release of curcumin,[30] dexamethasone [31,32] and other anti-inflammatory agents [33], functionalization with neuron adhesion factors [34] and hydrogel coatings [35]. The ECM is a non-cellular scaffold present in all tissues and, in the brain, makes up for approximately 10–20% of the total parenchymal volume. The ECM provides not only structural support to anchor cells, but it also regulates the diverse biochemical cues that guide neurogenesis, neuronal differentiation, survival, axonal growth, pathfinding, and synaptic plasticity [36]. Biomimetic coatings based on passive adsorption of covalent immobilized ECM proteins, such as laminin [37] and fibronectin [38] have been shown to reduce chronic microglia and astrocytic reactivity to silicon and metal intracortical microelectrode implants. In a recent work published by our group [39], we demonstrated that flexible depth microelectrodes coated with collagen and Matrigel films not only mitigate astrogliotic scarring, but also promote neuronal survival compared to stiff silicon implants. In the present study we evaluate whether a biomimetic approach based on ECM protein coatings, coupled with an ultra-compliant electrode structure, is a viable strategy for mitigating the chronic foreign body reaction to subdural microECoG arrays. To integrate ECM coatings on microfabricated flexible electrodes, we developed a high-throughput batch fabrication process that combines standard photolithographic patterning of microscale metallic features onto flexible polymeric substrates with direct micro-transfer molding and excimer laser micromachining of the ECM films. Using this custom approach, we show the feasibility of producing subdural flexible microECoG arrays predominantly comprised of natural materials and demonstrate that the mechanical, electrical and in vivo recording properties are comparable to those of the same flexible arrays without any coating. The naturally occurring ECM is a composite of a collagen base matrix–which constitutes up to 30% of the total protein mass, and provides tensile strength and structural integrity [40]—associated with different fibrous proteins, each providing specific biochemical cues to the cellular environment. In this study we also demonstrate the possibility of assembling freestanding films solely from collagen I and composites of collagen I and fibronectin, and test whether the film composition contributes to the modulation of the astrogliotic response to subdural microECoG implants. Materials and methods Fabrication of the microECoG electrode arrays Fabrication of microECoG electrodes began with the fabrication of the thin Au-parylene constructs, which served as controls and as the internal “core” of the ECM electrodes, using standard microfabrication methods previously described by Shen et al.[39]. Briefly, a ~ 5 μm-thick layer of Parylene C (poly-monochloro-para-xylylene, Specialty Coating Systems Inc.) was deposited on a silicon carrier wafer by chemical vapor deposition (CVD, PDS 2010, Specialty Coating Systems Inc.). A 100 nm-thick layer of Au was e-beam evaporated on the parylene substrate (Kurt J. Lesker Co.) patterned with photoresists. The 50 μm x 50 μm electrode sites and connecting traces were then defined using a lift-off process in acetone. To encapsulate the gold layer, another layer of parylene C (5 μm in thickness) was deposited via CVD. Subsequently, a patterned layer of Al (e-beam evaporated, 100 nm in thickness) was defined via photolithography and lift-off on the top parylene layer, serving as an etch mask. The electrode sites and contact pads for interfacing to an external data acquisition system were exposed using reactive ion etching (RIE) of the top parylene layer though the Al etch mask. The Al mask was then removed using wet etching and the Au-parylene constructs were lift-off from the wafer by immersion in DI water. For interfacing with the data acquisition system, the contact pads of microECoG electrodes were bonded to anisotropic conductive film (ACF, Elform Heat Seal Connectors) and connected to a custom-built interface board. ECM coating To fabricate the ECM-electrodes, the Au-parylene constructs were encapsulated with ECM films formed via micro-transfer-molding. Specifically, two types of ECM films were prepared: collagen I film and collagen I/fibronectin. The collagen I solution was composed of Type I rat tail collagen in a 3 mg mL−1 solution (Corning, Corning, NY), 10X phosphate buffered saline (PBS), and 0.1 M NaOH at a ratio of 13:2:1 by volume. Fibronectin/collagen I solution was formed by adding fibronectin powder (Sigma Aldrich, St. Louis, MO) to the collagen I solution such that the total protein content comprised 92% Type I collagen and 8% fibronectin by weight. The collagen I solution and the fibronectin/collagen I solution were polymerized at 37°C and 96% humidity for 24 hours to form ECM hydrogels, then dried in air at 37°C for 24 h, followed by rinsing with DI water three times, to form the ECM films. The ECM-encapsulated devices were then ablated using a UV excimer laser (193 nm, IPG Microsystems) to conform to the shape of the Au-parylene constructs and then stored covered overnight at ambient conditions. After overnight drying, the thickness of the complete devices was measured with a KLA-Tencor P7 profilometer. The total thickness of the ECM coating (top and bottom layer) was 30.0 ± 1.6 μm (Fig 1E). Download: PPT PowerPoint slide PNG larger image TIFF original image Fig 1. Fabrication of ECM-coated electrode arrays. (A) Schematics of the fabrication process of the Au-parylene microECoG arrays (step 1), followed by micro-transfer molding to form the ECM film and UV excimer laser ablation. (B) 3D schematics and dimensions of the ECM-coated arrays (thicknesses not drawn to scale). (C) Representative electrode array coated with a collagen film (dashed area) and assembled with the ACF connector (arrowhead). (D) False colored SEM image of the cross-section of the Au-parylene array coated with the ECM film, post UV excimer laser ablation. (E) Thickness profile of the ECM-coated arrays. https://doi.org/10.1371/journal.pone.0206137.g001 Bending stiffness analysis Bending stiffness of the uncoated Au microECoG arrays was calculated as: Eq 1 where Ep = 2.76 GPa is the Young’s modulus of parylene C [41] and wp and hp are the width and thickness of the microECoG array. For collagen-coated arrays, the thickness of collagen layer is comparable to that of the parylene encapsulation and, thus, the bending stiffness was calculated with the following modified version of Eq 1 [42,43]: Eq 2 where Ec is the Young’s modulus of collagen in the dry or hydrated state [39] and w and h are the width and thickness of the collagen film, respectively. Impedance characterization Electrochemical impedance spectroscopy (EIS) on bare Au or ECM-coated microECoG electrodes was performed with a Gamry Reference 600 potentiostat (Gamry Instruments) in a phosphate buffered saline bath (PBS) pH 7.4 at room temperature. EIS measurements were acquired by applying a 20 mV rms sinusoidal voltage input in the 1 Hz– 100 kHz range to a three-electrode electrochemical cell, with potentials referenced to Ag/AgCl (Sigma Aldrich), a graphite rod as counter electrode (Bio-Rad Laboratories, Inc.) and an electrode site on the microECoG arrays as the working electrode. To characterize the electrochemical properties of the Au and ECM interfaces, EIS data were fitted to equivalent circuit models of the interface impedance. Specifically, the interface impedance of the uncoated Au electrodes was modeled with a Randles circuit [44] modified to include the contribution of potential parasitic capacitance arising from the parylene insulation, whereas the ECM-coated electrodes were fitted to a custom defined model to account for the additional interface created by the ECM layer. In the modified Randles cell model for the uncoated Au electrodes the electrode-electrolyte interface is represented by the parallel of the ionic double layer (Zdl) impedance and the charge transfer resistance (Rct), in series with the spreading resistance of the ionic medium (Rs). The double layer impedance is Zdl = [Ydl(jω)n]-1, where Ydl is the equivalent capacitance, ω the frequency (in radians) and 0