TY - JOUR
AU - Khomenko, A.
AB - MEASUREMENT OF ELECTRICAL AND MECHANICAL QUANTITIES UDC 621.317.33 : 621.316.5.032 R. L. Melik-Davtyan, V. I. Tikhonov, and A. A. Khomenko Reduction of the contact resistance in connecting thermoelements is one of the basic problems in thermoelec- tric instrument making. Contact resistances in up-to-date designs amount to 1-4% of the semiconductor resistance, and this reduces the thermoelectric quality factor Z to the value of [1, 2] Zeff -- , (1) 1 § (2pc/0d) where p c is the specific contact resistance of connections, p is the semiconductor's resistivity, d the length through which current flows in the semiconductor rod. The contact resistance consists of the solder and connecting plate ~resistances, and the contact resistance of the metal-semiconductor barrier. The effect of the first two components on the thermoelectric efficiency have been dealt with in sufficient detail in [1]. We shall discuss the technique for measuring the barrier resistance in up-to- date thermoelectric devices. In selecting techniques for measuring semiconductor resistances under experimental production conditions, it is necessary to bear in mind the requirement of obtaining rapidly measurement results and eliminating the effect of the thermal emf on the measurements. In this connection the contact resistance was measured with an alternating 
TI - Contract resistances in cooling devices
JF - Measurement Techniques
DO - 10.1007/BF00812657
DA - 2004-11-29
UR - https://www.deepdyve.com/lp/springer-journals/contract-resistances-in-cooling-devices-Zed25k2cAo
SP - 568
EP - 570
VL - 17
IS - 4
DP - DeepDyve
ER -