TY - JOUR
AU - 
TI - Electromigration Study on Micro-vias of Multi-layer Anodic Alumina Substrate with a Thermal Compensated on-line Measurement Scheme
JF - 2007 8th International Conference on Electronic Packaging Technology
DO - 10.1109/icept.2007.4441386
DA - 2007-08-01
UR - https://www.deepdyve.com/lp/crossref/electromigration-study-on-micro-vias-of-multi-layer-anodic-alumina-ZX7vrOQ7K3
DP - DeepDyve
ER -