TY - JOUR
AU1 - Nomura, Takehiko
AU2 - Kubo, Tomoaki
AU3 - Suzuki, Ryouichi
AU4 - Sekiya, Satoshi
AU5 - Kamiya, Masashi
AB - With short wavelength light sources, VLSI chips with less than 0.5μm line width can be produced. In such case, alignment accuracy must be 0.1μm or less. Mechanical positioning accuracies of the stages, such as a wafer stage or a mask alignment stage, govern the total overlay accuracy. This report presents a mechanical improvement for the mask alignment stage, such as improvement in X,Y axes motion accuracy and realizing Z and tilt motion controls. A prototype compact and high precision alignment stage has been manufactured. In order to improve the X,Y motion accuracy, the stage has friction drive mechanisms and has a measuring method with analog/digital conversion of linear scale signals. In the experimental results obtained from the X,Y stage, less than 0.025μm motion resolution has been obtained.' No backlash, no stick-slip, and no hysteresis have been observed.
TI - High Precision Alignment Stage For Micro Lithography
JF - Proceedings of SPIE
DO - 10.1117/12.968403
DA - 1988-01-01
UR - https://www.deepdyve.com/lp/spie/high-precision-alignment-stage-for-micro-lithography-QiSG1VqLOs
SP - 66
EP - 72
VL - 922
IS - 
DP - DeepDyve
ER -