TY - JOUR
AU - 
AB - EJERS, European Journal of Engineering Research and Science Vol. 5, No. 11, November 2020 A Brief Review of Heat Sink, Heat Pipe, and Vapor Chamber as a Key Function of Thermal Solution for Electronic Devices Mohamed Elnaggar, Mohammed Abu Hatab, and Ezzaldeen Edwan Abstract — Electronics industry requires efficient design that description and carried out the mathematical and numerical can handle fast mathematical operations to compensate for the analysis without addressing other cooling tools. growing development and demand for processing power. These Based on that, the main contribution of this study is to days, there are numerous equipment or parts inside machines review thermal solutions using, vapor chamber, heat sink and called heating elements particularly with electrical or electronic heat pipe and to compare to each other and consider thermal devices and they should be cooled during the working process. design guidelines and factors as well. Additionally, in this However, with respect to their size, manufacturers are minifying day by day to satisfy requirements of users but the power should article, we will review the appropriate thermal solutions for be maintained. Hence, elements withstand a high amount of heat the produced heat from the electronic equipment and will and 
TI - A Brief Review of Heat Sink, Heat Pipe, and Vapor Chamber as a Key Function of Thermal Solution for Electronic Devices
JF - European Journal of Engineering Research and Science
DO - 10.24018/ejers.2020.5.11.1596
DA - 2020-11-06
UR - https://www.deepdyve.com/lp/unpaywall/a-brief-review-of-heat-sink-heat-pipe-and-vapor-chamber-as-a-key-OULIK4Ni7l
DP - DeepDyve
ER -