TY - JOUR
AU1 - Ainsworth, P.A.
AB - Arising from discussions at the International Institute of Welding Solder Paste Committee, the influences of a number of testing variables on the tack strength of solder pastes have been examined using the load cell system on a Meniscograph Solderability Tester. As a result, a standard method of testing has been proposed.
TI - Measurement of the Tackiness of Solder Pastes
JF - Microelectronics International
DO - 10.1108/eb044245
DA - 1986-03-01
UR - https://www.deepdyve.com/lp/emerald-publishing/measurement-of-the-tackiness-of-solder-pastes-MDTHsIFFys
SP - 27
EP - 29
VL - 3
IS - 3
DP - DeepDyve
ER -