TY - JOUR
AU - 
AB - Article Not peer-reviewed version Mold Fungal Resistance of Loose-Fill Thermal Insulation Materials Based on Processed Wheat Straw, Corn Stalk and Reed Ramunas Tupciauskas , Zigmunds Orlovskis , Karlis Trevors Blums , Janis Liepins , Andris Berzins , Gunars Pavlovics , Martins Andzs Posted Date: 19 January 2024 doi: 10.20944/preprints202401.1452.v1 Keywords: wheat straw; reed; corn stalk; steam-exploded pulp; thermo-mechanical pulp; lignocellulosic biomass; thermal insulation materials; mold fungi Preprints.org is a free multidiscipline platform providing preprint service that is dedicated to making early versions of research outputs permanently available and citable. Preprints posted at Preprints.org appear in Web of Science, Crossref, Google Scholar, Scilit, Europe PMC. Copyright: This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. Preprints (www.preprints.org) | NOT PEER-REVIEWED | Posted: 19 January 2024 doi:10.20944/preprints202401.1452.v1 Disclaimer/Publisher’s Note: The statements, opinions, and data contained in all publications are solely those of the individual author(s) and contributor(s) and not of MDPI and/or the editor(s). MDPI and/or the editor(s) disclaim responsibility for any injury to people or property resulting from any ideas, methods, instructions, or products referred to in the content. 
TI - Mold Fungal Resistance of Loose-Fill Thermal Insulation Materials Based on Processed Wheat Straw, Corn Stalk and Reed
DO - 10.20944/preprints202401.1452.v1
DA - 2024-01-19
UR - https://www.deepdyve.com/lp/unpaywall/mold-fungal-resistance-of-loose-fill-thermal-insulation-materials-M00ueB2VE2
DP - DeepDyve
ER -