TY - JOUR
AU - 
AB - Mech. Sci., 12, 451–459, 2021 https://doi.org/10.5194/ms-12-451-2021 © Author(s) 2021. This work is distributed under the Creative Commons Attribution 4.0 License. Simulation and fabrication of carbon nanotube–nanoparticle interconnected structures 1 2 1 1 3 1 Xiwen Lu , Jinhang Liu , Ye Ding , Lijun Yang , Zhan Yang , and Yang Wang School of Mechatronics Engineering, Harbin Institute of Technology, Harbin 150001, China Covidien (China) Medical Devices Technology Co., LTD, Shanghai 201114, China The Collaborative Innovation Center of Suzhou Nano Science and Technology, School of Mechanical and Electrical Engineering, Soochow University, Suzhou 215123, China Correspondence: Ye Ding (dy1992hit@hit.edu.cn), Lijun Yang (yljtj@hit.edu.cn), and Zhan Yang (yangzhan@suda.edu.cn) Received: 20 September 2020 – Revised: 28 February 2021 – Accepted: 15 March 2021 – Published: 27 April 2021 Abstract. With the rapid development of nanotechnology, the size of a device reaches sub-nanometer scale. The larger resistivity of interconnect leads to serious overheating of integrated circuits. Silicon-based electronic devices have also reached the physical limits of their development. The use of carbon nanotubes instead of traditional wires has become a new solution for connecting nano-structures. Nanocluster particles serving as brazing material play an important role in stabilizing the connection of carbon nanotubes, which places 
TI - Simulation and fabrication of carbon nanotube–nanoparticle interconnected structures
JF - Mechanical Sciences
DO - 10.5194/ms-12-451-2021
DA - 2021-04-27
UR - https://www.deepdyve.com/lp/unpaywall/simulation-and-fabrication-of-carbon-nanotube-nanoparticle-LlGlnRa32P
DP - DeepDyve
ER -