TY - JOUR
AU - Schwartz, Daniel T
AB - Direct-write nanomanufacturing with scanning beams and probes is flexible and canproduce high quality products, but it is normally slow and expensive to rasterpoint-by-point over a pattern. We demonstrate the use of an accelerated direct-writenanomanufacturing method called orchestrated structure evolution (OSE), where adirect-write tool patterns a small number of growth seeds that subsequently growinto the final thin film pattern. Through control of seed size and spacing, it ispossible to vary the ratio of top-down to bottom-up character of the patterningprocesses, ranging from conventional top-down raster patterning to nearly purebottom-up space-filling via seed growth. Electron beam lithography (EBL) and copperelectrodeposition were used to demonstrate trade-offs between process time andproduct quality over nano- to microlength scales. OSE can reduce process times forhigh-cost EBL patterning by orders of magnitude, at the expense of longer (butinexpensive) copper electrodeposition processing times. We quantify the degradation ofpattern quality that accompanies fast OSE patterning by measuring deviationsfrom the desired patterned area and perimeter. We also show that the density ofOSE-induced grain boundaries depends upon the seed separation and size. As theseed size is reduced, the uniformity of an OSE film becomes more dependent ondetails of seed nucleation processes than normally seen for conventionally patternedfilms.
TI - Orchestrated structure evolution: accelerating direct-write nanomanufacturing by combining top-down patterning with bottom-up growth
JF - Nanotechnology
DO - 10.1088/0957-4484/21/19/195306
DA - 2010-05-14
UR - https://www.deepdyve.com/lp/iop-publishing/orchestrated-structure-evolution-accelerating-direct-write-LE41tEpIYv
SP - 195306
VL - 21
IS - 19
DP - DeepDyve
ER -