TY - JOUR
AU - Seraphim, D.P.
AB - The fundamental considerations and mechanical integrity of printed circuit boards are reviewed, and mechanical analysis and modelling techniques provided. Fine line element techniques are utilised to model temperature distribution, thermally induced loading and moisture diffusion. Experimental testing techniques are used to make reliability assessment and to optimise material and processing developments.
TI - Mechanical Modelling for Printed Circuit Boards
JF - Circuit World
DO - 10.1108/eb046005
DA - 1985-02-01
UR - https://www.deepdyve.com/lp/emerald-publishing/mechanical-modelling-for-printed-circuit-boards-KqDDpncw3h
SP - 68
EP - 72
VL - 11
IS - 3
DP - DeepDyve
ER -