TY - JOUR
AU - Spangler, Leland
AB - Microsystem packages and package assembly processes have an enormous influence on the ability to successfully bring a microsystem product to market. Package and assembly processes can introduce both performance and reliability issues which can introduce significant delays in the product engineering cycle. Typically, thousands of devices must be made and tested to fully quantify the reliability of a microsystem product. While most microsystem products use package and package assembly technology adapted from the integrated circuit industry, the unique aspects of these devices requires unique package designs and unique implementation of the unit assembly processes. This paper discusses many of these unit processes, their adaptation to microsystem applications and the reliability issues that can be traced back to these processes. Solutions to these package assembly issues will also be presented.
TI - Assembly process issues and reliability in microsystem packaging
JF - Proceedings of SPIE
DO - 10.1117/12.531901
DA - 2004-01-24
UR - https://www.deepdyve.com/lp/spie/assembly-process-issues-and-reliability-in-microsystem-packaging-JD58euJKTf
SP - 101
EP - 113
VL - 5343
IS - 1
DP - DeepDyve
ER -