TY - JOUR
AU - Wang, W.
AB - We report fabrication of microscale Ta mold inserts by micro-electrical-discharge-machining (μEDM). Morphology, chemistry, and structure of the near-surface region of as-μEDMed Ta blanks have been characterized by scanning electron microscopy, X-ray photoelectron spectroscopy, and transmission electron microscopy. A TaC surface layer forms on as-μEDMed Ta surfaces. This altered surface layer was removed by electro-chemical-polishing. Further modification of Ta insert surfaces was accomplished by deposition of a conformal Ti-containing hydrogenated carbon coating. We demonstrate successful replication of high-aspect-ratio microscale structures in Al and Cu by compression molding with such surface-engineered Ta mold inserts.
TI - Fabrication of high-aspect-ratio microscale Ta mold inserts with micro electrical discharge machining
JF - Microsystem Technologies
DO - 10.1007/s00542-006-0198-8
DA - 2006-07-06
UR - https://www.deepdyve.com/lp/springer-journals/fabrication-of-high-aspect-ratio-microscale-ta-mold-inserts-with-micro-JAY0voOJ7B
SP - 503
EP - 510
VL - 13
IS - 6
DP - DeepDyve
ER -