TY - JOUR
AU - Olekhnovich, V. A.
AB - The thermal properties of a loop thermosyphon made of copper with a horizontally located evaporator, covered by a porous coating, and a condenser intended for cooling powerful electronic devices and transferring heat fluxes with a power of 1 kW and above have been studied. The characteristics of thermosyphon evaporators having capillary structures and liquid- and air-cooled condensers of various types were studied experimentally. It is shown that coating the capillary grooves by a thin layer of sintered powder makes it possible to more than halve the thermal resistance of the thermosyphon evaporator and that, with a condenser cooled by air, the total thermal resistance of the device does not exceed 0.1°C/W.
TI - Loop Thermosyphon for Cooling Heat-Loaded Electronics Components
JO - Journal of Engineering Physics and Thermophysics
DO - 10.1007/s10891-023-02840-8
DA - 2023-11-01
UR - https://www.deepdyve.com/lp/springer-journals/loop-thermosyphon-for-cooling-heat-loaded-electronics-components-IJmmXT91pd
SP - 1708
EP - 1715
VL - 96
IS - 7
DP - DeepDyve
ER -